Description
●Various PCB sizes and shapes as well as components available.
●Highest energy density for thermally demanding boards.
●Uniform heat distribution through convection and hybrid technology
●One device for all processes, including desoldering, pad cleaning, automatic positioning and soldering
●Simple, intuitive, tablet-compatible.
●Precision of placement within 15 µm
| Power consumption: | 3,500 VA | ||||
| Power solder pen: | 300 W, 35 l/min | ||||
| Power under-heating system: | 600-3,000 W (6 x IR-lamps) | ||||
| Size under-heating system: | 275 x 245 mm² | ||||
| Max. PCB size: | 305 x 305 mm² | ||||
| Resolution motion system: | 0,001 mm | ||||
| Placement accuracy: | ± 0,015 mm (Flip Chip)* | ||||
| ± 0,030 mm (CSP) | |||||
| ± 0,040 mm (BGA) | |||||
| ± 0,070 mm (Maxi BGA)* | |||||
| High resolution CMOS-camera: | 5 Mio. Pixel,USB2 | ||||
| Size of component: | Lens X Y | ||||
| Flip Chip* | min. | 0.2 mm | x | 0.2 mm | |
| max. | 15 mm | x | 12 mm | ||
| CSP | min. | 0.5 mm | x | 0.5 mm | |
| max. | 35 mm | x | 25 mm | ||
| BGA | min. | 1 mm | x | 1 mm | |
| max. | 45 mm | x | 35 mm | ||
| Maxi BGA* | min. | 2 mm | x | 2 mm | |
| max. | 70 mm | x | 55 mm | ||
| Mains: | 1Phase, 230VAC, Fuse 16A (Connector Type CEE 32A (3 phase) | ||||
| Pressurized air: | 5-8 bar, 100 l/min (clean, dry air) | ||||
| Dimensions: | 865 x 460 mm² | ||||
| Weight: | 75 kg | ||||
*Optional extras
- Dipping
- Paste Printing
- Solder Removal
- Soldering
- Desoldering
- Reballing
- Dispensing
| ● LED rework | ● QFP |
| ● Daughter boards | ● PoP |
| ● Interposer boards | ● DFN |
| ● Sub assemblies | ● QFN |
| ● RF frames | ● µBGA/CSP |
| ● RF shields | ● BGA |
| ● Rework on flex | ● Sockets |
| ● Small passives down to 0402 | ● Connectors |
| ● SON | ● CPU |
| ● PGA | ● Underfiller or coated components |
| ● LGA | ● Film capacitor |
Specification is subject to change without notice for the improvement of product performance.
