MARTIN Compact Hybrid Reflow Oven – MINIOVEN 05



●Optimized heat distribution via convection.

●Reflow of solder paste or solder balls.

●Compact format, innovative design and intuitive operation.

●Nitrogen connection for optimal reflow of solder balls.

●Use of temperature profiles via PC software.

●Tailored mask design.

Power consumption: 480 W
Power solder pen: 380 W, 35 l/min
Mains: 100 – 240VAC, fuse TG, 3A
Pressurized air: 7.5 l/min max. 4bar  (clean, dry air)
Dimensions: 270 x 150 x 60 mm3
Weight: 2.2 kg

Reballing Application with the MINIOVEN 05

Pre-bumping Application with the MINIOVEN 05

Specification is subject to change without notice for the improvement of product performance.