Description
●Flexibility in terms of the circuit board’s shape and size; up to 200 x 250 mm are able to be processed.
●Preheating circuit board for the subsequent Rework process, through to curing and cracking of underfill.
●Various operating modes, e.g. for consistent power, consistent temperature and profiles.
●HOTBEAM and SMART DESOLDER combination for the perfect rework.
●Use of temperature profiles via PC software.
●Table mount available.
| Power consumption: | 2,100 VA |
| Power underheating system: | 2,000 W (4 x IR-lamps) |
| Size underheating system: | 185 x 245 mm2 |
| Max. PCB size: | 200 x 260 mm2 |
| Temperature range: | 50 °C – 250 °C (1°C steps) |
| Mains: | 1 Phase, 85 – 250 VAC, 50 – 60 Hz |
| Cooling: | Electrically, 4 x fans |
| Dimensions: | 450 x 370 x 70 mm3 |
| Weight: | 4500 g |
Specification is subject to change without notice for the improvement of product performance.
