Description
●Optimized heat distribution via convection.
●Reflow of solder paste or solder balls.
●Compact format, innovative design and intuitive operation.
●Nitrogen connection for optimal reflow of solder balls.
●Use of temperature profiles via PC software.
●Tailored mask design.
| Power consumption: | 480 W |
| Power solder pen: | 380 W, 35 l/min |
| Mains: | 100 – 240VAC, fuse TG, 3A |
| Pressurized air: | 7.5 l/min max. 4bar (clean, dry air) |
| Dimensions: | 270 x 150 x 60 mm3 |
| Weight: | 2.2 kg |
Specification is subject to change without notice for the improvement of product performance.
