Description
●Preheating circuit board for the subsequent Rework process, through to curing and cracking of underfill.
●Various operating modes, e.g. for consistent power, consistent temperature and profiles.
●HOTBEAM and SMART DESOLDER combination for the perfect rework.
●Compact format, innovative design and intuitive operation.
●Use of temperature profiles via PC software.
●Table mount available.
| Power consumption: | 600 VA |
| Power underheating system: | 500 W (4 x IR-lamps) |
| Size underheating system: | 105 x 130 mm2 |
| Max. PCB size: | 130 x 150 mm2 |
| Temperature range: | 50°C-250°C (1°C stepse) |
| Mains: | 1 Phase, 85 – 250 VAC, 50 – 60 Hz |
| Cooling: | Electrically, 2 x fans |
| Dimensions: | 150 x 300 x 40 mm3 |
| Weight: | 800 g |
Specification is subject to change without notice for the improvement of product performance.
